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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Quint 2 Input AND/NAND Gate
The MC10E/100E104 is a quint 2-input AND/NAND gate. The function output F is the OR of all five AND gate outputs, while F is the NOR. The Q outputs need not be terminated if only the F outputs are to be used.
MC10E104 MC100E104
* * * *
600ps Max. Propagation Delay OR/NOR Function Outputs Extended 100E VEE Range of - 4.2V to - 5.46V 75k Input Pulldown Resistors Pinout: 28-Lead PLCC (Top View)
D3a 25 D3b D2a D2b VEE D1a D1b D0a 26 27 28 1 2 3 4 5 6 7 Q0 8 Q0 9 Q1 10 Q1 11 VCCO D0a D0b Q0 Q0 D4b 24 D4a 23 NC 22 VCCO 21 F 20 F 19 18 17 16 15 14 13 12 Q4 Q4 VCC Q3 Q3 Q2 Q2 F FN SUFFIX PLASTIC PACKAGE CASE 776-02
QUINT 2-INPUT AND/NAND GATE
LOGIC DIAGRAM
D0b VCCO
F
* All VCC and VCCO pins are tied together on the die.
D1a
Q1 Q1
PIN NAMES
Pin D0a - D4b Q0 - Q4 Q0 - Q4 F F Data Inputs AND Outputs NAND Outputs OR Output NOR Output Function
D1b
D2a D2b
Q2 Q2
D3a D3b
Q3 Q3
FUNCTION OUTPUTS
F= (D0a * D0b) + (D1a * D1b) + (D2a * D2b) + (D3a * D3b) + (D4a * D4b)
D4a D4b
Q4 Q4
12/93
(c) Motorola, Inc. 1996
2-1
REV 2
MC10E104 MC100E104
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0C Symbol IIH IEE Characteristic Input HIGH Current Power Supply Current 10E 100E 38 38 min typ max 200 46 46 38 38 min 25C typ max 200 46 46 38 44 min 85C typ max 200 46 53 Unit A mA Condition
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0C Symbol tPLH tPHL tSKEW tr tf Characteristic Propagation Delay to Output D to Q D to F Within-Device Skew D to Q Rise/Fall Times 20 - 80% Q F min 225 500 typ 385 725 75 max 600 1000 min 225 500 25C typ 385 725 75 max 600 1000 min 225 500 85C typ 385 725 75 ps 275 300 425 475 700 700 275 300 425 475 700 700 275 300 425 475 700 700 max 600 1000 ps 1 Unit ps Condition
1. Within-device skew is defined as identical transitions on similar paths through a device.
MOTOROLA
2-2
ECLinPS and ECLinPS Lite DL140 -- Rev 4
MC10E104 MC100E104
OUTLINE DIMENSIONS
FN SUFFIX PLASTIC PLCC PACKAGE CASE 776-02 ISSUE D
0.007 (0.180) U T L -M
M
B -NY BRK
M
S
N
S S
0.007 (0.180)
T L -M
N
S
D Z -L-M-
W
28 1
D X VIEW D-D G1 0.010 (0.250)
S
V
T L -M
S
N
S
A Z R
0.007 (0.180) 0.007 (0.180)
M
T L -M T L -M
S
N N
S
H
S
0.007 (0.180)
M
T L -M
S
N
S
M
S
C
E G G1 0.010 (0.250)
S
K1 0.004 (0.100) J -TSEATING PLANE
K F VIEW S 0.007 (0.180)
M
VIEW S T L -M
S
T L -M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 -- 0.025 -- 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 -- 0.020 2 10 0.410 0.430 0.040 --
MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 -- 0.64 -- 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 -- 0.50 2 10 10.42 10.92 1.02 --
ECLinPS and ECLinPS Lite DL140 -- Rev 4
2-3
MOTOROLA
MC10E104 MC100E104
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MOTOROLA 2-4
*MC10E104/D*
MC10E104/D ECLinPS and ECLinPS Lite DL140 -- Rev 4

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